Siliconware Precision (SPIL) is Upgraded by Goldman to Neutral

Siliconware Precision (SPIL) is Upgraded by Goldman to Neutral , according to the research report released to the investors. Earlier the firm had a rating of Sell on the company shares. The shares recommendation by the Brokerage Firm was released on Dec-23-2015.

Shares of Siliconware Precision Industries Company, Ltd. (NASDAQ:SPIL) ended Thursday session in red amid volatile trading. The shares closed down 0.02 points or 0.26% at $7.6 with 1,707,282 shares getting traded. Post opening the session at $7.52, the shares hit an intraday low of $7.52 and an intraday high of $7.63 and the price vacillated in this range throughout the day. The company has a market cap of $4,756 million and the number of outstanding shares has been calculated to be 625,800,000 shares. The 52-week high of Siliconware Precision Industries Company, Ltd. (NASDAQ:SPIL) is $9.17 and the 52-week low is $4.915.

During the last several months other analysts have commented on the company rating. Equity Analysts at the Brokerage Firm, Jefferies, downgrades their rating on the shares of Siliconware Precision Industries Company, Ltd. (NASDAQ:SPIL). Jefferies has a Hold rating on the shares. Previously, the analysts had a Buy rating on the shares. The rating by the firm was issued on October 28, 2015.

Analysts at Zacks have given a short term rating of hold on Siliconware Precision Industries Company, Ltd. (NASDAQ:SPIL) with a rank of 3. The shares has received an average rating of 1 from 1 brokerage firms. 1 analysts have rated the company as a strong buy.

Shares of Siliconware Precision Industries Co. Ltd. rose by 9.04% in the last five trading days and 11.11% for the last 4 weeks. Siliconware Precision Industries Co. Ltd. is up 15.5% in the last 3-month period. Year-to-Date the stock performance stands at 8.67%.”

Siliconware Precision Industries Co., Ltd. is principally engaged in the provision of semiconductor packaging and testing services. The Company operates its businesses through packaging services, which deals with plastic small outline integrated circuits (ICs), plastic quad flat packaging IC, ball grid array (BGA) ICs, quad flat no-lead ICs, chip scale packaging ICs and other IC products; bumping services, which offers 8- and 12-inch wafer bumping; testing services, which deals with 8- and 12-inch wafer sort testing, final testing and system level testing, as well as other business, which offers flash memory cards and other products. During the year ended December 31, 2013, the Company obtained approximately 81% of its total revenue from packaging services. It operates its businesses primarily in Taiwan and North America.